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<p><strong>Position Overview</strong></p><p>We are seeking a highly capable <strong>Customer Package Design Integration Engineer (2.5D / 3D Packaging) </strong> to ensure the successful execution of customer <strong>chiplet-based product</strong> development using Rapidus advanced packaging technologies.</p><p><br></p><p>This role serves as the <strong>primary technical and program interface between Rapidus and customers</strong>, integrating ADKs (Assembly Design Kits), packaging technologies, and customer design activities into a unified, successful outcome.</p><p><br></p><p>You will combine <strong>deep expertise in 2.5D/3D packaging and chiplet integration</strong> with <strong>strong program management and cross-functional coordination skills</strong> to drive customer designs from bring-up through tape-out in a rapidly evolving technology environment.</p><p><br></p><p><strong>Locations:</strong> Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)</p><p><strong>Employment Type:</strong> Full-time</p><p><strong>Department:</strong> Design Enablement / Advanced Packaging Technology</p><p><br></p><p><strong>About Rapidus</strong></p><p>Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting-edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.</p><p><br></p><p><strong>Key Responsibilities</strong></p><p><strong>Customer Design Integration & Enablement</strong></p><ul><li>Lead customer design bring-up using <strong>Rapidus Assembly Design Kits (ADKs)</strong></li><li>Guide customers in effectively applying:</li><li>Package design rules, libraries, and interface definitions</li><li>Interposer and substrate architectures</li><li>SI/PI/thermal design methodologies</li><li>Provide technical guidance on chiplet integration, including <strong>HBM, UCIe, PCIe, and high-speed SerDes</strong></li></ul><p><br></p><p><strong>Program Execution & Delivery Ownership</strong></p><ul><li>Drive customer projects toward <strong>successful 2.5D/3D package design tape-out and product realization:</strong></li><li>Manage:</li><li>Design schedules and milestones</li><li>Risks, issues, and dependencies</li><li>Cross-functional action items</li><li>Lead regular technical and program reviews with customers and internal teams</li></ul><p><br></p><p><strong>Cross-functional Integration (Core Responsibility)</strong></p><ul><li>Act as the central coordination point across:</li><li>Customer engineering teams</li><li>Package Design Engineering</li><li>ADK / Enablement teams</li><li>Process, manufacturing, and OSAT partners</li><li>Translate Rapidus technology updates into clear, actionable guidance for customers</li><li>Ensure alignment between design assumptions and manufacturing capabilities</li></ul><p><br></p><p><strong>Technical Issue Resolution</strong></p><ul><li>Support debugging and issue resolution in areas such as:</li><li>SI/PI and signal integrity challenges</li><li>Package layout and routing issues</li><li>ADK usage and interpretation</li><li>Drive root-cause analysis and coordinate solution deployment across teams</li></ul><p><br></p><p><strong>Continuous Improvement & Ecosystem Feedback</strong></p><ul><li>Capture customer feedback and drive improvements in:</li><li>ADK quality and usability</li><li>Design methodologies and flows</li><li>Documentation and training materials</li><li>Contribute to strengthening the chiplet ecosystem and customer readiness</li></ul><p><br></p><p><strong>Required Qualifications</strong></p><ul><li>B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, or related field</li><li>5+ years of experience in semiconductor packaging, system design, or customer-facing engineering roles</li><li>Strong understanding of:</li><li>2.5D / 3D packaging (interposer, TSV, hybrid bonding, RDL/fan-out)</li><li>High-speed interfaces (HBM, PCIe, UCIe, SerDes)</li><li><strong>Hands-on experience with package design and analysis tools (Cadence, Ansys, Synopsys, etc.)</strong></li><li>Proven ability to manage complex technical programs and cross-functional activities</li><li>Strong communication skills with customer-facing experience</li></ul><p><br></p><p><strong>Preferred Qualifications</strong></p><ul><li>Experience in foundry, OSAT, or semiconductor customer support roles</li><li>Familiarity with ADK / PDK and design enablement flows</li><li>Experience with die-package-system co-design methodologies</li><li>Background in HPC, AI, or networking systems</li><li>Experience in silicon bring-up, validation, or failure analysis</li><li>Knowledge of advanced substrates (ABF, glass core, fan-out RDL)</li><li>Japanese language skills for collaboration with Japan-based customers</li></ul><p><br></p><p><strong>What You Will Impact</strong></p><ul><li>Ensure successful <strong>customer design execution and tape-out delivery</strong></li><li>Bridge the gap between <strong>ADK (Assembly Design Kit: design environment)</strong> and <strong>real product realization</strong></li><li>Integrate design, technology, and execution into a coherent development flow</li><li>Accelerate customer adoption of Rapidus advanced packaging technologies at 2nm and beyond</li></ul><p><br></p><p><strong>What We Offer</strong></p><ul><li>Opportunity to play a critical role in customer success for next-generation chiplet platforms</li><li>Work at the intersection of <strong>technology, execution, and system integration</strong></li><li>Collaboration with global teams across the US and Japan</li><li>Competitive compensation and career growth opportunities</li></ul><p><br></p><p><strong>Benefits</strong></p><ul><li>Comprehensive Health, Dental and Vision coverage, fully at company's expense (no deductibles)</li><li>401k with no employer match</li></ul>
